Model

– HB650I02-Q470-B (non-WiFi)
– HB650I02I-Q470-B (WiFi)
– HB650I02-Q470-T (TPM/non-WiFi)
– HB650I02I-Q470-T (TPM/WiFi)

CPU/Chipset

– Intel® 10/11th LGA 1200 Socket Core i9/i7/i5/i3/Pentium/Celeron Comet Lake-S Processor (Max. 65W TDP)
– Intel Q470E Express chipset

MB Model

– MI02-10
– MI02-12 (TPM2.0)

BIOS

– AMI Flash ROM

Memory

– 2* Dual CH DDR4 2933/2666/2400MHz SDRAM SO-DIMM up to 64GB
* Core i9 / i7 CPUs support DDR4 up to 2933MHz
* Core i5 / i3 CPUs support DDR4 up to 2666MHz
* Pentium / Celeron CPUs support DDR4 up to 2400MHz

Network

– 1 * Intel i219LM GbE
– 1 * Intel i225LM 2.5GbE

Graphics

– Intel® HD Graphics, shared memory
– 2* HDMI 1.4 (Max Resolution: 4096×2160@30Hz)
– 1* DP (Max Resolution: 4096×2304@60Hz)
– Support Triple Displays

Storage

– 1* M.2 M-key (2280, PCIex4/SATA interface) support NVME

Expansion

– 1* M.2 E-key (2230, PCIex1/USB2.0) support CNVi
– 1* M.2 B-key (3042/3052, PCIex1/USB3.0) W/SIM card slot

Rear Panel I/O

– 2* RJ45
– 4* USB3.2(Gen.1)
– 1* DP
– 2* HDMI
– 1* Line out, 1* Mic
– 1* DC in (Industrial Connector)
– 4* COM (option)

Front Panel I/O

– 1* Power button , 1* Reset
– 1* Power LED, 1* HDD LED
– 4* USB2.0
– 1* FAN link con

Internal Connector

– SIM Card Holder

Power Source

– Adapter : AC 90~240V input / DC19V_120W output
– MB : DC12~28V input

Compliance

– CE, FCC, LVD, RoHS, ErP Ready

Dimensions

– System : 224 (W) * 199 (D) * 63 (H) mm
– Package : 406 (W) *359 (D) * 148 (H) mm
– Net Weight: 4 KG
– Gross Weight: 5 KG

Temperature

– Operating Temperature: -20 ~ 60° C
(Under the condition of using M.2 interface SSD)
– Storage Temperature: -40 ~ 85° C
– Humidity: 10% ~ 95% RH @40°C (non-condensing)

OS Support

– Windows 11, Linux